Jih Lin Technology, 0% 17oct2023, TWD (Conv.) (FIGI BBG00LPSSD23, TW0005285209)
国内債券, 転換社債, Zero-coupon bonds, Senior Unsecured
国内債券, 転換社債, Zero-coupon bonds, Senior Unsecured
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Jih Lin Technology Company Limited manufactures and sells stamping lead frames for the semiconductor packaging industry. The company is based in Kaohsiung, Taiwan and was founded in 2001.
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1 000 000
債券
80 234
株
167 970
ETF&投資信託
70 000
インデックス
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